Invitation to publish a Score Card for journal:
Thermal Engineering (ISSN: 1555-6301)
Dear Sir/Madam, You have recently published an article in the journal Thermal Engineering. Would you mind sharing your experiences with your colleagues? If so, please click on the link at the bottom of this message. After logging in, you will be forwarded to a Score Card for this journal. It will take you less than two minutes to complete this mini questionnaire. Your card will be added to the Quality Open Access Marker (www.qoam.eu) which also includes information about the publication fees. Thus, QOAM will become a true academic publishing forum enabling authors to make an informed decision based on the quality of the service a journal offers and see up front what it charges. For further contact, please use the Contact box of QOAM. Yours sincerely, Saskia de Vries and Leo Waaijers, founders of QOAM.
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2023 Radboud University Nijmegen (Last update 8/7/2023)
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Journal Score Card